Wafer blocks cutting machine
The Waffle Block Cutting Machine is designed for precise longitudinal and transverse cutting of waffle blocks into uniform portions with high repeatability and minimal product loss. Strip knives 3 mm wide and 0.3 mm thick ensure a clean cut without crumbling or layer deformation.
The equipment is used on waffle production lines to prepare blocks before glazing, packaging, or further processing of waffles, candies, and bars. Its compact design allows easy implementation in existing facilities without infrastructure reconstruction.
TM SISPRO supplies the machine as a standalone unit or as part of turnkey production lines, including ovens, filling machines, glazing, and packaging systems.
Technical Specifications:
Capacity: up to 10 blocks/min
Power: up to 3.5 kW
All SISPRO TM equipment is manufactured according to the Customer's technical specifications.
We adapt the design, performance, and configuration to the specifics of your production.
The cost is calculated individually – contact us to receive a commercial offer.
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