SISPRO presented an automatic wafer production line at IFFIP 2025

SISPRO took part in the International Forum of Food Industry and Packaging IFFIP 2025, which was held on April 16–18 in Kyiv (IEC).

The main exhibit was the automatic flat wafer production line — a complete industrial solution for large-scale wafer manufacturing. The equipment performs the full production cycle, including baking, cream application, cooling, stacking, and cutting of ready sheets.

Participation in IFFIP 2025 is an important step in the company’s development — an opportunity to showcase proprietary technologies, communicate with industry experts, meet partners, discuss new projects, and gain inspiration for further innovation.

For its participation, TM “SISPRO” was awarded a diploma for reliable partnership by the organizers — the Kyiv International Contract Fair.

SISPRO continues to expand its range of food industry equipment, offering modern technological solutions to Ukrainian and international manufacturers.